发明名称 |
APPARATUS FOR MEASURING WAFFER THICKNESS OF WHITE LED SCANING TYPE |
摘要 |
PURPOSE: A white light scanning type wafer thickness measuring apparatus is provided to obtain an improved image by reducing an error caused by light refraction according to the position of a wafer. CONSTITUTION: A white light scanning type wafer thickness measuring apparatus comprises a light source unit(20) which irradiates white light to a wafer, a camera(30) which receives the light reflected off the wafer, and a thickness calculation unit(50) which measures the thickness of the wafer by taking signals of specific wave lengths from image signals transmitted from the camera.
|
申请公布号 |
KR20110123944(A) |
申请公布日期 |
2011.11.16 |
申请号 |
KR20100043441 |
申请日期 |
2010.05.10 |
申请人 |
WISYS CO., LTD. |
发明人 |
YOO, KEUN HONG;LEE, JUNG WOO;KIM, YONG TAE |
分类号 |
G01B11/06 |
主分类号 |
G01B11/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|