Method for connecting an electronic component by a soldered wire loop and device obtained

摘要

The method involves forming a connection element (4) on electric contact zones of an electronic component e.g. contactless module, by integrating an end of a portion of an electrical wire to the electrical contact zone and fixing another end of the wire on an external surface of the component to offer a conducting loop between the two wire ends. A contact area (6) arranged on an external periphery of the loop is used to connect external contacts by simple contact pressure. An independent claim is also included for an electronic component integrated device.