Device for preheating a cooled component by conduction and/or convection

摘要

#CMT# #/CMT# The device has a heating coil (116) for heating a heat conducting piece (108) e.g. aluminum block, which is in contact with a component. A heat pipe (114) connects a heat sink (110) e.g. aliminum drain, with the heat conducting piece. The heat sink and the heat conducting piece are thermally isolated from one another, where the heat conducting piece is formed by an outgrowth of the heat pipe. The heat conducting piece and the heat pipe are made of lightweight heat material. #CMT#USE : #/CMT# Device for pre-heating a component such as electronic component i.e. computing processor, which is cooled by conduction and utilized in an onboard system of an aircraft, for starting the component. Can also be used for a component cooled by convection. #CMT#ADVANTAGE : #/CMT# The device rapidly raises the temperature of the component by preventing the evacuation of calories by an effect of freezing a fluid such as water, inside the heat pipe, thus bringing the temperature of the component to an acceptable level before the component is started, and hence assuring the starting of the component in an environment whose temperature is lower than a minimum operating temperature of the component. The heat conducting piece has small volume so as to limit the energy used to preheat the component. The heat conducting piece is formed by the outgrowth of the heat pipe, thus reducing the volume of material to be heated, and enhancing the efficiency of conduction between the heat pipe and the heat-conducting piece. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a sectional top view of a component pre-heating device. 108 : Heat conducting piece 110 : Heat sink 112a, 112b : Cold plates 114 : Heat pipe 116 : Heating coil.