PURPOSE: A texturing apparatus of a wire for semiconductor material cutting is provided to prevent the occurrence of a disconnection by coating grinding particles in a state of forming texture on the wire. CONSTITUTION: The texturing apparatus of a wire comprises a base plate(20). Connection bolts are installed on the four corners of the base plate. A guide bar is installed on the four corners of the base plate in a vertical direction. A bottom plate(30) installed on the top of the base plate. A top bobbin frame(42) is pivotally installed on the top of the bottom plate. A top plate(40) is ascended and descended corresponding to the bottom plate. A bottom bobbin frame(32) is pivotally installed in the lower part of the top plate. A diamond cutter(60) is installed in a wire fitting groove. The diameter of the diamond cutter is 0.1-0.2mm.
申请公布号
KR20110123873(A)
申请公布日期
2011.11.16
申请号
KR20100043331
申请日期
2010.05.10
申请人
KOREA POLYTECHNIC UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION;TPS CO., LTD.
发明人
CHO, UN CHUNG;LEE, WON GUN;KIM, HEUN DUK;MAE, YONG HOON;WOO, WON HUI;YUN, AE CHEON