首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Method for filling via hall and method of fabricating semiconductor package
摘要
申请公布号
KR101083042(B1)
申请公布日期
2011.11.16
申请号
KR20090048844
申请日期
2009.06.03
申请人
发明人
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
您可能感兴趣的专利
PUMP FOR HANDLING TWO-PHASE AND VISCOUS FLUIDS
METHOD OF INCREASED PRODUCTIVITY OF OIL WALL
DEVICE FOR SEALING MOUTH OF WELL
DEVICE FOR CONTROLLING SUCTION DREDGER
DEVICES FOR ROTARY PNEUMOMECHANICAL SPINNING
COMPOSITION FOR CONDUCTING DECORATIVE-PROTECTIVE INSULATION
MILK PRODUCT BAG
ROTARY AUTOMATIC MACHINE FOR DIE FORGING ROD ARTICLES
RUBBER CABLE BAND ASSEMBLING DEVICE
DEVICE FOR ASSEMBLY OF THREADED JOINTS
ELECTRIC EROSION ALLOYING APPARATUS
GRIP FOR IMPULSE FEEDING OF WELDING WIRE
HORIZONTAL SPLIT PART CHILL CASTING MACHINE
APPARATUS FOR BLASTING CORES FROM MOLDS
DEVICE FOR STEEL TOP-POUR
APPARATUS FOR FACING-UP MODELS MADE FROM FOAMED POLYSTYRENE
DEVICE FOR ROLLING BALL BEARING RACES
MACHINE FOR MANUFACTURE OF TIGHT BOTTOMS AT ENDS OF TUBULAR BILLETS
METHOD OF MANUFACTURING CERAMZITE CHARGING FOR WATER PURIFICATION FILTERS
DEVICE FOR PHYSIOTHERAPEUTIC CURING DISEASE OF PROSTATE
