| 摘要 |
the invention comprises an apparatus for applying a pull test to a bond of a semi-conductor assembly, the bond comprising a ball or a bump of solder, the apparatus comprising: a probe, said probe comprising a straight, thermally conductive pin; a heater for heating a tip of said probe to a temperature at or above a temperature at which the bond is melted; a holder for supporting said probe, the holder comprising a clamping mechanism that is configured to provide a clamping force on the probe; an actuation device for moving up and down said holder and said probe supported in said holder; a means for applying a pull force on said holder which in turn applies a pull force to said probe; and a force measuring system for measuring a force applied to said probe during the pull test, wherein after said probe tip has been heated to a temperature at or above a temperature at which the bond is melted, said probe tip is brought into contact with the bond, the bond is melted by heating of the probe and the bond is cooled and solidified to fix the probe tip in the bond, the probe is then retracted by the pull force applying means to apply a pull force to the bond, which pull force is measured by said force measuring system. |
