PURPOSE: A semiconductor package processing method is provided to improve the laser machining accuracy of a semiconductor strip by detecting positional deviation between a solder ball and a via hole and revising the irradiation position of a laser beam. CONSTITUTION: The location of a semiconductor strip(10) is detected. A via hole is processed by irradiating a laser beam in a solder ball pad(12). The via hole which is processed is recorded by a vision camera. The deviation of the center position of the via hole and the center position of the solder ball pad of a semiconductor package is calculated. A laser beam irradiation position is revised as the calculated deviation.
