发明名称 |
Filler for filling a gap and method for manufacturing semiconductor capacitor using the same |
摘要 |
A filler for filling a gap includes a hydrogenated polysiloxazane having an oxygen content of about 0.2 to about 3 wt %. A chemical structure of the hydrogenated polysiloxazane includes first, second, and third moieties represented by the following respective Chemical Formulas 1-3: The third moiety is on a terminal end of the hydrogenated polysiloxazane, and an amount of the third moiety is about 15 to about 35% based on a total amount of Si—H bonds in the hydrogenated polysiloxazane.
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申请公布号 |
US8058711(B2) |
申请公布日期 |
2011.11.15 |
申请号 |
US20100956549 |
申请日期 |
2010.11.30 |
申请人 |
LIM SANG-HAK;YUN HUI-CHAN;HAN DONG-IL;KWAK TAEK-SOO;BAE JIN-HEE;OH JUNG-KANG;KIM SANG-KYUN;KIM JONG-SEOB;CHEIL INDUSTRIES, INC. |
发明人 |
LIM SANG-HAK;YUN HUI-CHAN;HAN DONG-IL;KWAK TAEK-SOO;BAE JIN-HEE;OH JUNG-KANG;KIM SANG-KYUN;KIM JONG-SEOB |
分类号 |
H01L23/58;G11B5/706;H01L21/20;H01L21/469 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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地址 |
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