发明名称 Method and device for measuring soil parameters by means of compaction machines
摘要 A soil compaction device has a vibrated contact element that makes contact with the soil during a contact phase and that is exposed to a contact force exerted by the soil and travels over a contact distance. A dynamic stiffness of the soil is formed from the gradient of the contact force and from the contact distance. Furthermore, a contact surface parameter to take account of the actual contact surface of the contact element with the soil is determined. The dynamic deformation modulus is then the product of the contact surface parameter and the dynamic stiffness. The method allows the determination of the dynamic deformation modulus, and hence of the soil stiffness, during the compaction operation.
申请公布号 US8057124(B2) 申请公布日期 2011.11.15
申请号 US20070280391 申请日期 2007.02.19
申请人 STENZEL OTTO W.;WAGNER STEFAN;LANGE DITTMAR;WACKER NEUSON PRODUKTION GMBH & CO. KG 发明人 STENZEL OTTO W.;WAGNER STEFAN;LANGE DITTMAR
分类号 G01N3/00;E01C19/38 主分类号 G01N3/00
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