发明名称 |
Method for capping a MEMS wafer |
摘要 |
A method for capping a MEMS wafer to form a hermetically sealed device. The method includes applying a glass bonding agent to the cap wafer and burning off organic material in the glass bonding agent. The cap wafer/glass bonding agent combination is then cleaned to reduce lead in the combination. The cleaning is preferably accomplished using an oxygen plasma. The MEMS device is coated with a WASA agent. The cap wafer is then bonded to the MEMS wafer by heating this combination in a capping gas atmosphere of hydrogen molecules in a gas such as nitrogen, argon or neon. This method of capping the MEMS wafer can reduce stiction in the MEMS device. |
申请公布号 |
US8058144(B2) |
申请公布日期 |
2011.11.15 |
申请号 |
US20090468185 |
申请日期 |
2009.05.19 |
申请人 |
BHAGAVAT MILIND;TARVIN ERIK;SAMMOURA FIRAS;YANG KUANG;SPARKS ANDREW;ANALOG DEVICES, INC. |
发明人 |
BHAGAVAT MILIND;TARVIN ERIK;SAMMOURA FIRAS;YANG KUANG;SPARKS ANDREW |
分类号 |
H01L21/46;C03B29/00 |
主分类号 |
H01L21/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|