SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to make a high-capacity multichip package by perpendicularly mounting a memory chip and control chip. CONSTITUTION: A lead frame(110) comprises first leads and second leads. An interposer(120) comprises a body and a circuit pattern arranged on the body. A first bonding pad is included on each upper surface of first semiconductor chips(130). A second semiconductor chip(140) is attached on the first semiconductor chip which is placed in the uppermost part of the first semiconductor chips. A conductive wire(150) electrically connects the first and second semiconductor chips, lead frame, and interposer.