发明名称 |
Apparatus for measuring a mechanical quantity |
摘要 |
An apparatus structure and measurement method are provided to retain high precision and high reliability of a semiconductor mechanical quantity measuring apparatus which senses a mechanical quantity and transmits measured information wirelessly. As to a silicon substrate of the semiconductor mechanical quantity measuring apparatus, for example, a ratio of a substrate thickness to a substrate length along a measurement direction is set small, and a ratio of a substrate thickness to a substrate length along a direction perpendicular to the measurement direction is set small. The apparatus upper surface is covered with a protective member. It is possible to measure a strain along a particular direction and realize mechanical quantity measurement with less error and high precision. An impact resistance and environment resistance of the apparatus itself can be improved. |
申请公布号 |
US8056421(B2) |
申请公布日期 |
2011.11.15 |
申请号 |
US20100719977 |
申请日期 |
2010.03.09 |
申请人 |
SUMIGAWA TAKASHI;OHTA HIROYUKI;HITACHI, LTD. |
发明人 |
SUMIGAWA TAKASHI;OHTA HIROYUKI |
分类号 |
G01B7/16 |
主分类号 |
G01B7/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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