发明名称 Configuration of a multi-die integrated circuit
摘要 A method of configuring an integrated circuit (IC) can include receiving configuration data within a master die of the IC. The IC can include the master die and a slave die. A master segment and a slave segment of the configuration data can be determined. The slave segment of the configuration data can be distributed to the slave die of the IC.
申请公布号 US8058897(B1) 申请公布日期 2011.11.15
申请号 US20100825286 申请日期 2010.06.28
申请人 LU WEIGUANG;EDWARDS ERIC E.;LAMARCHE PAUL-HUGO;YOUNG STEVEN P.;GAIDE BRIAN C.;LEYBA, II JOE EDDIE;XILINX, INC. 发明人 LU WEIGUANG;EDWARDS ERIC E.;LAMARCHE PAUL-HUGO;YOUNG STEVEN P.;GAIDE BRIAN C.;LEYBA, II JOE EDDIE
分类号 H03K19/173;H01L25/00 主分类号 H03K19/173
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