发明名称 Substrates with slotted metals and related methods
摘要 Substrates with slotted metals and related methods are provided. According to one aspect, a slotted metal attached to a substrate can include a metal patterned with slots less than or about equal to 2 microns. The slots can result in line widths that are approximately the size of a single metallurgical grain in an unpatterned layer.
申请公布号 US8059385(B2) 申请公布日期 2011.11.15
申请号 US20070999522 申请日期 2007.12.05
申请人 MORRIS, III ARTHUR S.;DEREUS DANA;CUNNINGHAM SHAWN J.;WISPRY, INC. 发明人 MORRIS, III ARTHUR S.;DEREUS DANA;CUNNINGHAM SHAWN J.
分类号 H01G5/00;H01G4/005;H01G7/00 主分类号 H01G5/00
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