KÜHLSYSTEM FÜR LED-CHIP-ANORDNUNG

摘要

Disclosed is a cooling system for an LED chip array on a multilayer circuit board. Said cooling system comprises: a multilayer circuit board that has metal layers (3) which are exposed towards the outside for positioning chips and are structured in a staggered manner for displaying LED arrays; several LED chips (8) which are applied directly to the exposed metal layers; at least one staggered structure of the LED-equipped metal layers in metal layer zones that extend outward in relation to the LEDs, exposed metal layers having a large surface; and at least one cooling element which is coupled to the exposed metal layers in a manner providing high heat conductivity.