| 发明名称 |
Chip scale power converter package having an inductor substrate |
| 摘要 |
A chip scale power converter package having an inductor substrate and a power integrated circuit flipped onto the inductor substrate is disclosed. The inductor substrate includes a high resistivity substrate having a planar spiral inductor formed thereon.
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| 申请公布号 |
US8058960(B2) |
申请公布日期 |
2011.11.15 |
| 申请号 |
US20070729311 |
申请日期 |
2007.03.27 |
| 申请人 |
HEBERT FRANCOIS;SUN MING;ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED |
发明人 |
HEBERT FRANCOIS;SUN MING |
| 分类号 |
H01F5/00;H01F7/06;H01F27/28;H05K7/00 |
主分类号 |
H01F5/00 |
| 代理机构 |
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