发明名称 |
Light-emitting diode integration scheme |
摘要 |
A circuit structure includes a carrier substrate, which includes a first through-via and a second through-via. Each of the first through-via and the second through-via extends from a first surface of the carrier substrate to a second surface of the carrier substrate opposite the first surface. The circuit structure further includes a light-emitting diode (LED) chip bonded onto the first surface of the carrier substrate. The LED chip includes a first electrode and a second electrode connected to the first through-via and the second through-via, respectively.
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申请公布号 |
US8058669(B2) |
申请公布日期 |
2011.11.15 |
申请号 |
US20090535525 |
申请日期 |
2009.08.04 |
申请人 |
CHEN DING-YUAN;CHIOU WEN-CHIH;YU CHEN-HUA;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHEN DING-YUAN;CHIOU WEN-CHIH;YU CHEN-HUA |
分类号 |
H01L33/00 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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