发明名称 Manufacturing method for semiconductor devices
摘要 A polysilazane perhydride solution, prepared by dispensing polysilazane perhydride in a solvent containing carbon, is applied on a semiconductor substrate (1), thereby forming a coated film (6), which is heated, volatilizing solvent therein, thereby forming a polysilazane film (7), which is chemical-treated, so the polysilazane film (7) is changed to a silicon dioxide film (8).
申请公布号 US8058139(B2) 申请公布日期 2011.11.15
申请号 US20090392584 申请日期 2009.02.25
申请人 SATO KATSUHIRO;NAKAJIMA TAKAHITO;KABUSHIKI KAISHA TOSHIBA 发明人 SATO KATSUHIRO;NAKAJIMA TAKAHITO
分类号 H01L21/76 主分类号 H01L21/76
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