发明名称 Electrode mounting structure of surface treatment apparatus
摘要 An electrode mounting structure of a surface treatment apparatus in which a metal electrode is disposed so as to oppose to an inner-peripheral surface of a cylinder, the electrode and the cylinder are energized in a state where treatment liquid is interposed between the electrode and the cylinder inner-peripheral surface so as to perform pre-plating or plating to the cylinder inner-peripheral surface, and the metal electrode is detachably attached to a metal electrode holder member. The structure includes a resin coupler having a threaded portion engaged with a threaded portion formed on the electrode holder member.
申请公布号 US8057647(B2) 申请公布日期 2011.11.15
申请号 US20090490034 申请日期 2009.06.23
申请人 ASOU TOMOHIRO;KUNIOKA SEIYA;MURAMATSU HITOSHI;SUZUKI NOBUYUKI;ISHIBASHI AKIRA;KAWAI MAKOTO;SUZUKI MOTOR CORPORATION 发明人 ASOU TOMOHIRO;KUNIOKA SEIYA;MURAMATSU HITOSHI;SUZUKI NOBUYUKI;ISHIBASHI AKIRA;KAWAI MAKOTO
分类号 C25B9/02;C25C7/02;C25D17/06 主分类号 C25B9/02
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