发明名称 |
Electrode mounting structure of surface treatment apparatus |
摘要 |
An electrode mounting structure of a surface treatment apparatus in which a metal electrode is disposed so as to oppose to an inner-peripheral surface of a cylinder, the electrode and the cylinder are energized in a state where treatment liquid is interposed between the electrode and the cylinder inner-peripheral surface so as to perform pre-plating or plating to the cylinder inner-peripheral surface, and the metal electrode is detachably attached to a metal electrode holder member. The structure includes a resin coupler having a threaded portion engaged with a threaded portion formed on the electrode holder member. |
申请公布号 |
US8057647(B2) |
申请公布日期 |
2011.11.15 |
申请号 |
US20090490034 |
申请日期 |
2009.06.23 |
申请人 |
ASOU TOMOHIRO;KUNIOKA SEIYA;MURAMATSU HITOSHI;SUZUKI NOBUYUKI;ISHIBASHI AKIRA;KAWAI MAKOTO;SUZUKI MOTOR CORPORATION |
发明人 |
ASOU TOMOHIRO;KUNIOKA SEIYA;MURAMATSU HITOSHI;SUZUKI NOBUYUKI;ISHIBASHI AKIRA;KAWAI MAKOTO |
分类号 |
C25B9/02;C25C7/02;C25D17/06 |
主分类号 |
C25B9/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|