发明名称 |
Methods of forming semiconductor chip underfill anchors |
摘要 |
Various semiconductor chips and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in an insulating layer applied to a side of a semiconductor chip. The first opening does not extend through to the side. A second opening is formed in the insulating layer that exposes a portion of the side.
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申请公布号 |
US8058108(B2) |
申请公布日期 |
2011.11.15 |
申请号 |
US20100721289 |
申请日期 |
2010.03.10 |
申请人 |
TOPACIO RODEN R.;MCLELLAN NEIL;ATI TECHNOLOGIES ULC |
发明人 |
TOPACIO RODEN R.;MCLELLAN NEIL |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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