METHOD AND STRUCTURE OF PHOTOVOLTAIC GRID STACKS BY SOLUTION-BASED PROCESS

摘要

PURPOSE: A photoelectric cell grid stacking method by a solution-based process and a structure thereof are provided to electronically plate a thick thickness part of copper near to zero stress, thereby improving mechanical strength. CONSTITUTION: A nickel or cobalt layer is plated with photo induction. A silicide layer is arranged by RTA(Rapid Thermal Annealing) of the plated nickel or cobalt layer. A selective barrier layer is evaporated on the silicide layer. A copper layer is attached on a silicide/barrier film layer. A thin protection layer is chemically or electro-mechanically applied on the upper part of the copper layer.