THERMOCONDUCTIMETRIC ANALYZER FOR SOLDERING PROCESS IMPROVEMENT

摘要

Performance of a flux in a soldering process is assessed by monitoring the activity of the flux via its electrical conductance measured using a probe having interdigitated metallic traces and a temperature sensor. The measured conductance- temperature time profile provides information useful for selecting a suitable flux formulation and soldering conditions for a given application, for determining the cause of soldering process problems, and for developing improved flux formulations.