WAFER LEVEL PACKAGE AND METHODS FOR FABRICATING THE SAME

摘要

PURPOSE: A wafer level package and a formation method thereof are provided to arrange a second encapsulated pattern with moisture permeability while filling a gap, thereby preventing deviation of an external connection terminal. CONSTITUTION: A rewiring pattern(60) is arranged on a semiconductor device. A first encapsulated pattern(70) is formed in order to be directly touched with the rewiring pattern. The first encapsulated pattern comprises a via hole. The external connection terminal(80) is arranged on the rewiring pattern within the via hole. The external connection terminal includes a gap in order to be separated from the upper end part of a lateral wall of the via hole.