| 摘要 |
PURPOSE: A semiconductor package is provided to reduce a power noise by arranging a passive device on the lower side of the semiconductor chip and attenuating the length of a power line between a semiconductor chip and the passive device. CONSTITUTION: A substrate(110) includes a cavity(111), a plurality of first bond fingers, and a plurality of a second bond fingers(113). A semiconductor chip(130) includes a plurality of bonding pads in an upper side. A passive device(150) is arranged in the lower side of the semiconductor chip to be placed in the cavity of the substrate. A connecting member(180) electrically connects the passive device and the substrate. |
