发明名称 HEAT SINK STRUCTURE FOR LIGHTING LAMP USING PLATING AND MANUFACTURING METHOD THEREFOR
摘要 PURPOSE: A plastic heat dissipation body by utilizing a plating process and a manufacturing method thereof are provided to improve thermal conductivity by plating metal on plastic resin with a predetermined thickness, thereby making light heat dissipation body for illumination. CONSTITUTION: A heat dissipation body part(110) is formed with plastic resin. A copper plating part(120) is plated with copper in order to improve thermal conductivity. The thickness of the copper plating part is 10 to 600 μm. A penetration hole(115) is arranged in the body part in order to effectively dissipate heat generated by illumination. A secondary plating part(130) is arranged on the copper plating part.
申请公布号 KR20110123119(A) 申请公布日期 2011.11.14
申请号 KR20100042590 申请日期 2010.05.06
申请人 ASP SEMICONDUCTOR 发明人 LEE, JUNG WOO
分类号 F21V29/00 主分类号 F21V29/00
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