| 摘要 |
<p>PURPOSE: A molding apparatus for manufacturing a semiconductor package and a molding method thereof are provided to improve a molding yield at a molding area by pressurizing a molding resin with a pressurizable block and cohering the molding resin to a molding area between the surfaces of a cavity space and a strip substrate. CONSTITUTION: An upper mold(110) includes a adsorption device which adsorbs a strip substrate. A low mold includes a center block(121), a side block(122), and a pressurizable block. The side block is arranged in the edge of a side of the center block. A cavity is formed in the upper side of the center block with the center block and the side block. The depth of the cavity is controlled by controlling the height of the side block.</p> |
