CO-W ALLOYS ELECTROLESS PLATING SOLUTION WITH LOW TEMPERATURE, ELECTROLESS PLATING METHOD USING THE SAME AND CO-W ALLOYS COATING LAYER PREPARED BY THE SAME

摘要

PURPOSE: A cobalt-tungsten alloy electroless plating solution, an electroless plating method using the same, and a cobalt-tungsten alloy coating layer manufactured by the same are provided to control plating thickness by controlling a speed of plating. CONSTITUTION: A cobalt-tungsten alloy electroless plating solution comprises cobalt acetate or cobalt sulfate, ammonium tungstate, DMAB(dimethyl amine borane), TMAB(trimethyl amine borane), citric acid sodium, boric acid as pH stabilizer and additive. The additive is made from the metal salt which includes one of Sn, Zn, Mg, Pb and Cd or the group consisting of their mixture. The additive is added in 0.1~10ppm. The concentration of cobalt acetate or cobalt sulfate is 10~ 20g/L. The concentration of ammonium tungstate is 5~10g/L. The concentration of DMAB or TMAB is 2.5~10g/L. The concentration of glycine is 10~80g/L. The concentration of boric acid is 20~60g/L.