发明名称 |
METHOD FOR PROCESSING SEMICONDUCTOR PACKAGES |
摘要 |
PURPOSE: A method for processing a semiconductor package is provided to improve productivity and working efficiency by irradiating a laser beam on a location which is corresponded to each solder ball pad along a spiral locus. CONSTITUTION: One of a plurality of spiral locus patterns, which is saved in the controller of a laser beam irradiating apparatus, is selected. A spiral locus is generated by inputting data about a selected spiral locus pattern. A laser beam irradiation condition is inputted for a generated spiral locus. A laser beam is irradiated on a location which is corresponded to each solder ball pad along the spiral locus.
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申请公布号 |
KR20110122810(A) |
申请公布日期 |
2011.11.11 |
申请号 |
KR20110110199 |
申请日期 |
2011.10.26 |
申请人 |
HANMISEMICONDUCTOR CO., LTD. |
发明人 |
HUH, YIL;CHOI, HONG CHAN;KIM, YOUNG HWAN |
分类号 |
H01L21/00;H01L23/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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地址 |
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