| 摘要 |
PURPOSE: A semiconductor package is provided to reduce a stress which is applied to a semiconductor package by including an organic binder in a conductive die bonding materials including a first metal. CONSTITUTION: An interpose(2) loads a semiconductor chip(4). A sealing resin covers the semiconductor chip. An interposer connection terminal(3) is placed on the interposer. The rear side(4') of the semiconductor chip and the interposer connection terminal are electrically connected by a conductive Ag(silver) paste(5). A solder resist(7) is formed on the interposer in order to secure an adhesive force between the sealing resin(6) and the interposer. |
