RESIN SEAL TYPE SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a resin seal type semiconductor package which prevents the generation of a metallic burr on a cut face when cut into pieces while enabling a solder fillet to be formed to facilitate an inspection of a soldering state, and to provide a method for manufacturing the resin seal type semiconductor package.

SOLUTION: The resin seal type semiconductor package comprises external terminals 13-16 to be connected with a mounting board and a resin body 12 that encloses the external terminals 13-16. The resin body 12 has openings formed by resin recessed sections 18 and 19 on a part of a bottom face and side faces. The external terminals 13-16 are formed inside the resin body 12 so that edges of the external terminals 13-16 are positioned closer to a center of the resin body 12 than the sides of the resin body 12. The second external terminals 14 and 16 are exposed through the openings formed by the resin recessed sections 18 and 19.

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