摘要 |
<P>PROBLEM TO BE SOLVED: To realize high heat dissipation performance without notably changing an external dimension (appearance) of a heat dissipation structure. <P>SOLUTION: The heat dissipation structure includes a heat conduction layer 1 and an inner layer 2 provided on an inside of the heat conduction layer 1 and having a three-dimensional shape imparting layer on an innermost face-side. In the heat conduction layer 1, a heat conductivity in at least one direction in the layer is 2 W/m K or above, an average thickness is 0.2 to 5 mm and a product of the heat conductivity and the average thickness is 0.01 W/K or above. In the three-dimensional shape imparting layer, a plurality of uneven portions, which have an average valley width of 1 to 20 mm, an average ridge width of 0.5 to 5 mm and an average height that is 1 to 10 times as much as the average valley width, are arranged to be brought into contact with at least a part of a heating unit in 10% or above region of the inner layer. A surface area of a region where the three-dimensional imparting layer is disposed is 1.2 times as much as a case of a flat surface without the uneven portion. <P>COPYRIGHT: (C)2012,JPO&INPIT |