| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package which comprises: a semiconductor element chip; multiple photoelectric conversion modules; external light connecting parts, the number of which is smaller than that of the multiple photoelectric conversion modules; and multiple optical waveguides formed between the multiple photoelectric conversion modules and the external light connecting parts, the semiconductor package being able to decrease an absolute value of optical losses at the multiple optical waveguides, reduce the variation of optical losses at the multiple optical waveguides, and make the multiple optical waveguides be disposed in a small area. <P>SOLUTION: Multiple optical waveguides 5 are bundled and connected to external light connecting parts, the number of which is smaller than that of the multiple photoelectric conversion modules 3, and each optical waveguide 5 comprises, viewed from the side of the external light connecting parts: a first straight line part 14; a curved line part 15 having no inflection points; and a second straight line part 16 whose linear direction is different from the linear direction of the first straight line part 14. <P>COPYRIGHT: (C)2012,JPO&INPIT |
