| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip protecting film which improves reworkability after forming a protective film and has an excellent adhesion reliability after heat curing. <P>SOLUTION: A chip protecting film 10 comprises a curable protective film forming layer 2 and release sheets 1 temporarily adhered to both surfaces of the curable protective film forming layer 2. The curable protective film forming layer 2 contains a binder polymer component which is an acrylic copolymer having a glass-transition temperature (Tg) of equal to or higher than 0°C, an epoxy resin, a hardener of the epoxy resin, a silica filler, at least either of a pigment or a dye, and a filler with a volume ranging from 55 mass% to 75 mass%. A compounding ratio ((b+c)/a) of the epoxy resin and the hardener of the epoxy resin against the binder polymer component is within a specified range from 0.3 to 0.9. <P>COPYRIGHT: (C)2012,JPO&INPIT |
