发明名称 CUTTING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a cutting apparatus that can control the depth of a groove formed on a workpiece with high precision without reducing a processing efficiency. <P>SOLUTION: A cutting apparatus has imaging means for imaging the cross-sectional shape of a processing groove 9 formed on a dividing scheduled line L from the outer peripheral surface side of a workpiece W. A cut-in amount to a dividing scheduled line to be afterwards processed is controlled on the basis of a cut-in amount of a cutting blade 30 into the workpiece W which is obtained from the cross-sectional shape of the processing groove 9 imaged by the imaging means 8, thereby forming a processing groove having a desired depth with high precision. The depth of the processing groove can be recognized and the cut-in amount of the cutting blade can be readjusted before one dividing scheduled line L is processed to form the processing groove 9 and then the cutting blade 30 is positioned to a cutting start position for a subsequent dividing schedule line, so that the processing efficiency can be prevented from being reduced. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011228331(A) 申请公布日期 2011.11.10
申请号 JP20100093874 申请日期 2010.04.15
申请人 DISCO ABRASIVE SYST LTD 发明人 MINATO KOKICHI
分类号 H01L21/301;B24B49/12;B28D1/24;B28D5/00 主分类号 H01L21/301
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