发明名称 |
WIRING BOARD, ELECTRONIC EQUIPMENT WITH THE WIRING BOARD, AND PROBE CARD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board capable of preventing disconnection between a surface conductor provided on a principal surface of an insulating board and a via conductor provided inside the insulating board when stress by thermal expansion difference between the surface conductor and the via conductor is generated in the direction in parallel with the principal plane at a connection part between the surface conductor and the via conductor. <P>SOLUTION: The wiring board is constituted by providing the surface conductor (4) on the principal plane of the insulating board (5) and electrically connecting the surface conductor (4) to the via conductor (3) formed in the insulating board (5). On the wiring board, the surface conductor (4) has a pore for introducing the tip of the via conductor (3), and the via conductor (3) is formed so that the outer peripheral surface of the tip contacts the inner peripheral surface of the pore. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2011228727(A) |
申请公布日期 |
2011.11.10 |
申请号 |
JP20110130343 |
申请日期 |
2011.06.10 |
申请人 |
KYOCERA CORP |
发明人 |
TEGA HITOSHI;MIYAWAKI TADASHI |
分类号 |
H05K3/34;G01R1/073;H01L23/12;H05K1/11 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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