| 摘要 |
An assembly (100) is provided comprising a first chip (20) and a second chip (30) which are interconnected through solder connections. These comprise, at the first chip, an underbump metallisation and a solder bump, and, at the second chip, a metallisation. In this case the solder bump is provided as a fluid layer with a contact angle of less than 90° C., and an intermetallic compound is formed on the basis of the metallisation at the second chip, and at least one element of the composition is applied as the solder bump.
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