| 摘要 |
Disclosed is a copper foil for a printed circuit formed from a secondary particle layer, which is formed from a three-element alloy comprising copper, cobalt, and nickel, on a primary particle layer, following the formation of a copper primary particle layer on the surface of a copper foil. Specifically disclosed is a copper foil for a printed circuit characterized by the average particle diameter in the primary particle layer being 0.25 - 0.45 µm and the average particle diameter in the secondary particle layer formed from the three-element alloy comprising copper, cobalt, and nickel being 0.05 - 0.25 µm. The disclosed copper foil for a printed circuit reduces occurrences of powder falling off of the copper film, increases the peel strength, and improves the heat resistance by forming a secondary particle layer by copper-cobalt-nickel alloy plating on a copper primary particle layer, after that primary particle layer is formed on the surface of a copper foil. |
