| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing tape-integrated film for a semiconductor back surface, the film which keeps a good detachability when a semiconductor element is picked up, prevents generation of chip scattering and chipping of the semiconductor element when dicing a semiconductor wafer, and prevents cutting water used in dicing from intruding between an adhesive layer and a flip-chip film used for a semiconductor back surface when dicing the semiconductor wafer, and to provide method for producing a semiconductor device. <P>SOLUTION: The dicing tape-integrated film for a semiconductor back surface according to the present invention comprises: a flip-chip film for a semiconductor back surface, the film flip-chip-connected onto the adhered body and used for protecting the back surface of a semiconductor element; and a dicing tape. The dicing tape has a structure in which at least a sticker layer is provided on a base member, and the flip-chip type film for the semiconductor back surface is provided on the adhesive layer. The sticker layer is a radiation curable type which decreases the adhesive force to the flip-chip film for the semiconductor back surface through irradiation with radiation. <P>COPYRIGHT: (C)2012,JPO&INPIT |
