发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can reduce defects of metal wires and its manufacturing method. <P>SOLUTION: A substrate 2 having a connection terminal 4, a semiconductor device 3 arranged on the substrate 2, a metal wire 5 connecting the semiconductor device 3 and the connection terminal 4, and a sealing resin 9 sealing the semiconductor device 3 and the metal wire 5 are provided. A metal plate 10 for heat dissipation is arranged on the surface of the sealing resin 9, and the metal plate 10 for heat dissipation has a projection 12 at the position opposing the semiconductor device 3. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011228540(A) 申请公布日期 2011.11.10
申请号 JP20100098102 申请日期 2010.04.21
申请人 PANASONIC CORP 发明人 MATSUMOTO NAOKI;RI SHINKA
分类号 H01L23/36;H01L21/56 主分类号 H01L23/36
代理机构 代理人
主权项
地址
您可能感兴趣的专利