摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can reduce defects of metal wires and its manufacturing method. <P>SOLUTION: A substrate 2 having a connection terminal 4, a semiconductor device 3 arranged on the substrate 2, a metal wire 5 connecting the semiconductor device 3 and the connection terminal 4, and a sealing resin 9 sealing the semiconductor device 3 and the metal wire 5 are provided. A metal plate 10 for heat dissipation is arranged on the surface of the sealing resin 9, and the metal plate 10 for heat dissipation has a projection 12 at the position opposing the semiconductor device 3. <P>COPYRIGHT: (C)2012,JPO&INPIT |