REAR-SURFACE FILM FOR FLIP-CHIP SEMICONDUCTOR, DICING TAPE INTEGRATED REAR-SURFACE FILM FOR SEMICONDUCTOR, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND FLIP-CHIP SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a rear-surface film for a flip-chip semiconductor and a dicing tape integrated rear-surface film for semiconductor that can suppress or prevent the warp of a semiconductor element which is mounted onto a adherend by flip chip connection.

SOLUTION: A rear-surface film for a flip-chip semiconductor to be provided for a rear surface of a semiconductor element which is mounted on a adherend by flip chip has a contraction amount due to thermal curing of 2 vol.% or more and 30 vol.% or less with respect to the total volume of the rear-surface film for a flip-chip semiconductor before the thermal curing.

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