| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide fine particles for epoxy resin curing that are used as a curing agent for epoxy resins, are excellent in dispersibility in an epoxy resin composition, and can enhance reliability of a cured product by reducing a linear expansion coefficient of the cured product. <P>SOLUTION: The fine particle for epoxy resin curing has a group producing a base by heat on the surface of an inorganic fine particle, wherein the group producing a base by heat has structure represented by general formula (1). In general formula (1), Y is a divalent organic group; R<SP POS="POST">1</SP>and R<SP POS="POST">2</SP>are each a hydrogen atom, a methyl group, or an aromatic group; and R<SP POS="POST">3</SP>and R<SP POS="POST">4</SP>are substituents whose sum of Hammett substituent constants σ is 0-0.85. <P>COPYRIGHT: (C)2012,JPO&INPIT |
