发明名称 PHOTOCURABLE RESIN COMPOSITION, SEALING AGENT FOR ORGANIC EL ELEMENT, AND ORGANIC EL ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a photocurable resin composition being superior in coatability and having a high moisture resistance when it is cured and further provide a sealing agent for an organic EL element composed of the photocurable resin composition and an organic EL element produced by using the photocurable resin composition and/or the sealing agent for an organic EL element. <P>SOLUTION: The photocurable resin composition contains a cationically polymerizable compound and a cationic photopolymerization initiator. The cationically polymerizable compound contains at least one type of epoxy resin selected from the group consisting of an epoxy resin having a biphenyl skeleton, an epoxy resin having a naphthalene skeleton, and an epoxy resin having an anthracene skeleton and contains an epoxy resin having a liquid aromatic cyclic skeleton at 25&deg;C. In the cationically polymerizable compound, the content of a total of the epoxy resin having a biphenyl skeleton, the epoxy resin having a naphthalene skeleton, and the epoxy resin having an anthracene skeleton is 20% to 50% by weight, and the content of the epoxy resin having the liquid aromatic cyclic skeleton at 25&deg;C is 50% to 80% by weight. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011225773(A) 申请公布日期 2011.11.10
申请号 JP20100098914 申请日期 2010.04.22
申请人 SEKISUI CHEM CO LTD 发明人 SON UNCHORU
分类号 C08G59/24;C08K3/00;C08L63/00;H01L51/50;H05B33/04 主分类号 C08G59/24
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