发明名称 MANUFACTURING METHOD OF ULTRASONIC PROBE AND ULTRASONIC PROBE
摘要 The manufacturing yield of semiconductor devices (CMUTs) is improved. Before a polyimide film serving as a protective film is formed, a membrane is repeatedly vibrated to evaluate the breakdown voltage between an upper electrode and a lower electrode, and the upper electrode of a defective CMUT cell whose breakdown voltage between the upper electrode and the lower electrode is reduced due to the repeated vibrations of the membrane is removed in advance to cut off the electrical connection with other normal CMUT cells. By this means, in a block RB or a channel RCH including the recovered CMUT cell RC, reduction in the breakdown voltage between the upper electrode and the lower electrode after the repeated vibrations of the membrane is prevented.
申请公布号 US2011272693(A1) 申请公布日期 2011.11.10
申请号 US201013144229 申请日期 2010.01.06
申请人 HITACHI MEDICAL CORPORATION 发明人 KOBAYASHI TAKASHI;MACHIDA SHUNTARO
分类号 H01L29/66;H01L21/66 主分类号 H01L29/66
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