| 摘要 |
A carrier comprises a base plate, a polymeric film, which has been bound on a surface of the base plate, and a ligand, which has been bound with the polymeric film. The ligand has been bound with the polymeric film at a density falling within the range of 1.0×1016 pieces/mm3 to 3.3×1018 pieces/mm3. The carrier is produced with a process, comprising the steps of: causing the polymeric film to bind on the base plate, and causing the ligand to bind with the polymeric film, the step of causing the ligand to bind with the polymeric film being performed in an organic solvent.
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