| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a laser beam machine with which, when a double-side substrate has the top and bottom layers composed of copper foil, and a laser beam is used to remove an inner-layer resin without removing the bottom-layer copper foil to thereby form a blind hole, the chance of such a failure that the bottom-layer copper foil suffers penetration is reduced. <P>SOLUTION: A method of fixing a double-side substrate in a laser beam machine, includes: arranging, on a top table 19, electromagnets 32 for generating magnetic field over the top table 19, and arms 28 for applying electric current to the top-layer copper foil of the double-side substrate 18; and taking advantage of the magnetic field of the electromagnets 32 and the electric current on the top-layer copper foil of the double-side substrate 18 to generate a Lorentz force in the double-side substrate 18, thereby fixing the double-side substrate 18 on a fixture plate 25. <P>COPYRIGHT: (C)2012,JPO&INPIT |
