| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the size of a thermal head substrate by providing an alignment mark for mounting an integrated circuit on a heat generating region. <P>SOLUTION: A thermal head includes: the thermal head substrate 20 formed in a long rectangular form; the heat generating region P including a plurality of heat generating elements 26 arranged in rows in the vicinity of one long side 20a on the thermal head substrate 20; and a mounting region Q in which a plurality of driver integrated circuits 30 causing selectively the plurality of heat generating elements 26 to be driven while generating heat are mounted on regions other than the heat generating region P on the thermal head substrate 20 and input/output patterns of the plurality of driver integrated circuits 30 are formed. The alignment mark A for face-down-mounting the plurality of driver integrated circuits 30 on the mounting part region Q is provided in the heat generating region. <P>COPYRIGHT: (C)2012,JPO&INPIT |
