| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the following problems: development of technology for forming a thin film having a submicron level thickness on a large base material or substrate having undulation or unevenness is desired and structure having excellent maintainability without being made large-scaled is required for the formation of the thin film. <P>SOLUTION: There is provide a thin film application method using a slit coater head applying a low viscous application material line-like with very small variation as a supply mechanism of application liquid and combining an anilox roll having a length equal to an application width and a small diameter plate cylinder as a pair of transfer roll lines. In a pair of a small sized roller system, transfer defect due to the deflection of a roller shaft which causes trouble in the coating of a large sized base material is tackled by the arrangement of a pair of the roller. The continuity of the small diameter plate cylinder is attained by the ingenuities of materials and a joining method to make the plate cylinder seamless. An application liquid supply line and a transfer line are packaged compact to provide the thin film application apparatus having excellent maintainability and reliability. <P>COPYRIGHT: (C)2012,JPO&INPIT |
