Device for electrical interconnection of electrical contact area of e.g. direct copper bonded ceramic substrate, with electrical contacting area of printed circuit board, has contacting region contacting contacting area at or in board

摘要

#CMT# #/CMT# The device (1) has electrical conductive angular press-in insertion pins (4) passing through an electrical non-conductive frame element (2) and non-positively-and/or positively fastening to a printed circuit board. Each of the insertion pins comprises a contacting region i.e. bonding surface, for contacting an electrical contacting area to a ceramic substrate and another contacting region i.e. press-in contact, for contacting the electrical contacting area at or in the board. The contacting regions of the insertion pins are covered by a plastic and provided on brackets, respectively. #CMT#USE : #/CMT# Device for an electrical interconnection of an electrical contact area of a ceramic substrate e.g. direct copper bonded ceramic substrate and active metal brazed ceramic substrate, with electrical contacting area of a printed circuit board in a power electronic (all claimed). #CMT#ADVANTAGE : #/CMT# The device allows the printed circuit board to be mechanically held to a frame member or the ceramic substrate by the press-in pins, thus enabling simple, inexpensive and better electrical interconnection between the electrical contact areas of the ceramic substrate and the printed circuit board, and hence ensuring the simple and inexpensive manufacturing of the power electronics with the printed circuit board and the ceramic substrate and ensuring better functional quality of the printed circuit board. The device protects the ceramic substrate on electronic components from moisture, and ensures better heat dissipation of the electronic components of the ceramic substrate. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a top perspective view of a device for an electrical interconnection of an electrical contact area of a ceramic substrate with an electrical contacting area of a printed circuit board. 1 : Device for an electrical interconnection of an electrical contact area of a ceramic substrate with electrical contacting area of a printed circuit board 2 : Electrical non-conductive frame element 4 : Electrical conductive angular press-in insertion pins.