| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method permitting prevention of wire sweep and wire short circuiting caused by an injected resin. <P>SOLUTION: By a semiconductor device manufacturing method, a semiconductor chip 109 is mounted on a wiring board 100, the wiring board 100 and the semiconductor chip 109 are connected by stretching a first wire group 120 and a second wire group 118 less in wire length than the first wire group, and a sealing body 401 covering the semiconductor chip 109, the first wire group 120 and the second wire group 118 is formed by injecting a sealing resin 307 from the first wire group 120 toward the second wire group 118. <P>COPYRIGHT: (C)2012,JPO&INPIT |
