| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus which can change a progress state of bonding when substrates are bonded, and to provide a substrate treatment method therefor. <P>SOLUTION: The substrate treatment apparatus forms one substrate by bonding a bonding face of a first substrate and a bonding face of a second substrate, and includes: a mounting section for mounting the first substrate thereon; a holding section for holding a peripheral portion of the second substrate which is arranged so as to face the first substrate mounted on the mounting section with a predetermined space; a state changing section for changing a holding state of the peripheral portion held by the holding section; and a control section for controlling the state changing section to change the progress state of the bonding. <P>COPYRIGHT: (C)2012,JPO&INPIT |
